Prolyx Microelectronics Private Limited
Uttarahalli, Bengaluru, Karnataka
GST No. 29AABCP9422H1Z8
08048609186 82% Response Rate
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- Semiconductor Wafers
Banking on the technical expertise of our professionals, we trade and supply a quality tested array of Semiconductor Wafers. The Semiconductor Wafers we offer is suitable to meet the applications of various applications.
| Minimum Order Quantity | 25 Piece |
| Product Type | Substrates |
| Brand | ICEMOS |
| Usage/Application | Semiconductor Fabrication |
| Material | Silicon on Insulator |
| Doping | P or N type |
| Purity | 99.99% |
| Wafer Diameter | 200 mm |
| Handle Thickness Tolerance | 5 micrometre |
IceMOS is a global leader in the development and manufacture of high quality MEMS product substrates as well as advanced engineering substrates based on our wafer bonding technology. Our products include:
| Usage/Application | Glass |
| Color | Transparent |
| State | Solid |
| Packaging Type | Box |
| Material | Borofloat |
| Brand | Prolyx |
| Size | 6 inch |
To meet the needs and requirements of the clients, we are offering a quality tested array of Borosilicate Glass Wafers. Our offer Glass Wafers is suitable to meet the applications of various industries. Besides, we assure our clients that a quality tested array is delivered from our end. Besides, we assure our clients that a quality tested array is delivered from our end.
Features:
| Minimum Order Quantity | 10 Piece |
| Brand | Prolyx |
| Material | Al2O3 |
| Purity | 99.99% |
| Diameter | 3 inch |
| Shape | Round |
| Density | 3.97 g/cm3 |
| Country of Origin | Made in India |
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| Minimum Order Quantity | 2 Number |
| Material | Silicon |
| Usage/Application | Semiconductor Fabrication |
| Product Type | Silicon wafers |
| Doping | P or N type or Intrinsic |
| Purity | 99.99% |
| Capacity | NA |
| Polished | Single / Double side polished |
| Resistivity | Depending on requirement |
| Orientation | Depending on requirement |
| Wafer (Si) Size/Thickness | Depending on diameter of wafer & requirement |
| Surface Treatment | Single / Double side polished |
| Diameter | 50 to 200 mm |
Silicon Wafer technology refers to the use of a layered silicon-insulator-silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance, thereby improving performance. SOI-based devices differ from conventional silicon-built devices in that the silicon junction is above an electrical insulator.
| Doping | P or N type |
| Polished | Single side polished |
| orientation | 100 or 111 |
| thickness | 280-300 microns |
| Resistivity | Upto 10 Ohm.cm |
| size | 2 inch |
| Minimum Order Quantity | 10 Piece |
| Thickness | 4 mm |
| Color | Transparent |
| Is It Waterproof | Waterproof |
| Material | Indium Tin Oxide |
| Size | Can cut into any sizes |
| Shape | Square |
| Operating Temperature | Below 500 Degree Celsius |
| Product: | ITO conductive glass / transparent conductive oxide (TCO) substrate |
| Material: | Tin-doped indium oxide (Sn:In2O3), ITO film on glass |
| Appearance: | Highly transparent colorless glass |
| Glass Thickness: |
Standard Thickness • 1.1 mm
Other Thicknesses • 0.5 mm • 0.55 mm • 0.7 mm • 1.8 mm |
| Glass Size: | Can cut into any sizes |
| Sheet Resistance: |
• Standard 10 - 100 Ω/sq (see Table below) • Other resistance ranges available |
| Temperature Range: | Recommended usage below 500 °C since glass may melt at higher temperature |