|Service Mode||Off Line|
|Service Types||Gold Ball and Aluminium Wedge Wire Bonding|
|Service Duration||2 to 3 Days|
We offer Microelectronic Packaging Services which includes wafer dicing, die attach, wire bonding and encapsulation. Our polycarbonate parts meet industry flame-retardant standards, and may be applied to solve air flow problems, or to provide required internal shielding.