|Max. 200 x 300 mm
Semiconductor Chips are bonded on the package, Chips and internal leads of package are connected by bonding, using fine metal wires of aluminium and Gold for commercial/IOT/RF/Medical/Optoelectronic devices.
We offer High accuracy, high speed and automation to achieve reliable wire bonding services by
|Minimum Order Quantity
|Wire Bonder Machine
|Gold Ball and Aluminium Wedge Wire Bonding
|2 to 3 Days