|Minimum Order Quantity||100 Nos|
|Machine Type||Wire bonding machine|
|Service Mode||Off Line|
|Service Types||Gold Ball and Aluminium Wedge Wire Bonding|
|Service Duration||2 to 3 Days|
|Country of Origin||Made in India|
Semiconductor Chips are bonded on the package, Chips and internal leads of package are connected by bonding, using fine metal wires of aluminium and Gold for commercial/IOT/RF/Medical/Optoelectronic devices.
We offer High accuracy, high speed and automation to achieve reliable wire bonding services by