Prolyx Microelectronics Private Limited
Prolyx Microelectronics Private Limited
Kumaraswamy Layout, Bengaluru, Karnataka
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Microelectronic Packaging Services

We are the service provider of Microelectronic Packaging Services to our customers.
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  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
Microelectronic Packaging Services
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Microelectronic Packaging Services

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Product Details:
Services LocationBangalore
Service ModeOff Line
Service TypesGold Ball and Aluminium Wedge Wire Bonding
Service Duration2 to 3 Days
We offer Microelectronic Packaging Services which includes wafer dicing, die attach, wire bonding and encapsulation. Our polycarbonate parts meet industry flame-retardant standards, and may be applied to solve air flow problems, or to provide required internal shielding.


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