Prolyx Micro Electronics Private Limited
Bengaluru, Karnataka
GST No. 29AABCP9422H1Z8
Call 0804778913795% Response Rate
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Microelectronic Packaging Services
We are the service provider of Microelectronic Packaging Services to our customers.
Microelectronic Packaging Services
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Rs 500 / PiecesPrice on Request
Product Brochure
| Minimum Order Quantity | 100 Pieces |
| Machine Type | Wire Bonder Machine |
| Services Location | Bangalore |
| Service Mode | Off Line |
| Service Types | Gold Ball and Aluminium Wedge Wire Bonding |
| Service Duration | 2 to 3 Days |
We offer Microelectronic Packaging Services which includes wafer dicing, die attach, wire bonding and encapsulation. Our polycarbonate parts meet industry flame-retardant standards, and may be applied to solve air flow problems, or to provide required internal shielding.
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Wire Bonding Services
Get Best Quote
Rs 100 / PiecePrice on Request
Product Brochure
| Service Location | Bangalore |
| Usage/Application | Microelectronics |
| Size | Max. 200 x 300 mm |
| Service Mode | Offline |
| Service Duration | 2-3 Days |
Semiconductor Chips are bonded on the package, Chips and internal leads of package are connected by bonding, using fine metal wires of aluminium and Gold for commercial/IOT/RF/Medical/Optoelectronic devices.
We offer High accuracy, high speed and automation to achieve reliable wire bonding services by
- Gold-wire thermocompression ball-bonding method
- Aluminium-wire ultrasonic wedge bonding
- Reliability measurements using Pull tester ( pull test gauge)
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