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Prolyx Microelectronics Private Limited
Prolyx Microelectronics Private Limited
Vasanthapura, Bengaluru, Karnataka
GST No. 29AABCP9422H1Z8
08048609186 90% Response Rate
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Microelectronic Packaging Services

We are the service provider of Microelectronic Packaging Services to our customers.
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  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
Microelectronic Packaging Services
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Microelectronic Packaging Services

Product Price : Get Latest Price
Product Details:
Minimum Order Quantity100 Nos
Machine TypeWire bonding machine
Services LocationBangalore
Service ModeOff Line
Service TypesGold Ball and Aluminium Wedge Wire Bonding
Service Duration2 to 3 Days
We offer Microelectronic Packaging Services which includes wafer dicing, die attach, wire bonding and encapsulation. Our polycarbonate parts meet industry flame-retardant standards, and may be applied to solve air flow problems, or to provide required internal shielding.


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COB(Chip On Board) Wire Bonding Services
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COB(Chip On Board) Wire Bonding Services

Product Price : Get Latest Price
Product Details:
Copper Thicknesscustomized
Usage/ApplicationMicroelectronics
Mounted Productyes
SizeMax. 200mm*300mm
Colorgreen
DesignCustomised
Country of OriginMade in India

Semiconductor Chips are bonded on the package, Chips and internal leads of package are connected by bonding, using fine metal wires of aluminium and Gold for commercial/IOT/RF/Medical/Optoelectronic devices.

We offer High accuracy, high speed and automation to achieve reliable wire bonding services by

  • Gold-wire thermocompression ball-bonding method
  • Aluminium-wire ultrasonic wedge bonding
  • Reliability measurements using Pull tester ( pull test gauge)

Additional Information:
  • Production Capacity: Depends on PCB design
  • Delivery Time: As per Schedule
  • Packaging Details: As per Semiconductor packaging standards
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