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Prolyx Microelectronics Private Limited
Prolyx Microelectronics Private Limited
Vasanthapura, Bengaluru, Karnataka
GST No. 29AABCP9422H1Z8
08048609186 90% Response Rate
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Microelectronic Packaging Services

We are the service provider of Microelectronic Packaging Services to our customers.
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  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
  • Microelectronic Packaging Services
Microelectronic Packaging Services
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Microelectronic Packaging Services

Approx. Price: Rs 500 / PiecesGet Latest Price
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Service Details:
Minimum Order Quantity100 Pieces
Machine TypeWire Bonder Machine
Services LocationBangalore
Service ModeOff Line
Service TypesGold Ball and Aluminium Wedge Wire Bonding
Service Duration2 to 3 Days
We offer Microelectronic Packaging Services which includes wafer dicing, die attach, wire bonding and encapsulation. Our polycarbonate parts meet industry flame-retardant standards, and may be applied to solve air flow problems, or to provide required internal shielding.


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  • Wire Bonding Services
  • Wire Bonding Services
  • Wire Bonding Services
  • Wire Bonding Services
  • Wire Bonding Services
  • Wire Bonding Services
  • Wire Bonding Services
  • Wire Bonding Services
  • Wire Bonding Services
Wire Bonding Services
Get Best Quote

Wire Bonding Services

Approx. Price: Rs 100 / PieceGet Latest Price
View Brochure
Service Details:
Service LocationBangalore
SizeMax. 200 x 300 mm
Usage/ApplicationMicroelectronics
Service ModeOffline
Service Duration2-3 Days

Semiconductor Chips are bonded on the package, Chips and internal leads of package are connected by bonding, using fine metal wires of aluminium and Gold for commercial/IOT/RF/Medical/Optoelectronic devices.

We offer High accuracy, high speed and automation to achieve reliable wire bonding services by

  • Gold-wire thermocompression ball-bonding method
  • Aluminium-wire ultrasonic wedge bonding
  • Reliability measurements using Pull tester ( pull test gauge)

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