|Packaging Type||Semiconductor devices|
|Model Name/Number||Tresky T-4909AE|
|Bonding Accuracy||Up to 10 microns|
|Size Of Machine||Table top|
The T-4909-AE anniversary edition is a manual, budget sensitive die bonder withsuperior ergonomic design. As with all of Tresky’s products, the T-4909-AE incorporatesTrue Vertical Technology™ which guarantees parallelism between chip and substrate at anybond height. Bonding parameters and sequences, intuitively programmable by an integratedRaspberry PC with touchscreen.
- Item Code: T-4909AE
- Production Capacity: NA
- Delivery Time: 8 weeks