Service Details:
Packaging Type | Semiconductor devices |
Model Name/Number | Tresky T-4909AE |
Capacity | NA |
Bonding Accuracy | Up to 10 microns |
Size Of Machine | Table top |
The T-4909-AE anniversary edition is a manual, budget sensitive die bonder withsuperior ergonomic design. As with all of Tresky’s products, the T-4909-AE incorporatesTrue Vertical Technology™ which guarantees parallelism between chip and substrate at anybond height. Bonding parameters and sequences, intuitively programmable by an integratedRaspberry PC with touchscreen.
Additional Information:
- Item Code: T-4909AE
- Production Capacity: NA
- Delivery Time: 8 weeks