Prolyx Micro Electronics Private Limited

Bengaluru, Karnataka

GST No. 29AABCP9422H1Z8

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Scientific Equipments

Pioneers in the industry, we offer manual die bonder from India.

Manual Die Bonder

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Product Brochure

Minimum Order Quantity1
Model Name/NumberTresky T-4909AE
Bonding AccuracyUp to 10 microns
Size Of MachineTable top
Packaging TypeSemiconductor devices
The T-4909-AE anniversary edition is a manual, budget sensitive die bonder withsuperior ergonomic design. As with all of Tresky’s products, the T-4909-AE incorporatesTrue Vertical Technology™ which guarantees parallelism between chip and substrate at anybond height. Bonding parameters and sequences, intuitively programmable by an integratedRaspberry PC with touchscreen.

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