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Prolyx Microelectronics Private Limited
Prolyx Microelectronics Private Limited
Vasanthapura, Bengaluru, Karnataka
GST No. 29AABCP9422H1Z8
08048609186 90% Response Rate
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Wire Bonding Machine

Offering you a complete choice of products which include automatic wire bonder machine, manual wire bonding machine and semi automatic wire bonding machine.
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Automatic Wire Bonder Machine
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Automatic Wire Bonder Machine

Approx. Price: Rs 150 Lakh / UnitGet Latest Price
Product Brochure
Product Details:
Bonding Accuracy+/-5um
BrandF & S Bondtec
Wire TypesGold Wire, 17, 5-50um on 2" spool
BondheadBall-Wedge for gold wire, Standard capillaries 16mm length
Ultrasonic SystemF&S Generator 68 kHz
Axes Working Area200x150 mm
Programmable Step Resolution1um
Programmable Z Axis100 mm stroke
Hardware SupportDual-Core PC with Windows, Ethernet, USB 2.0/3.0,Colour Display 22"
USB DisplayUSB 2.0/3.0,Colour Display 22"
CameraGigE-CCD-Colour Camera,5 Mpixel
Control Speed1 Wire/sec
Repeatability+/-3um
Dimension92x71x65 cm
Weight80 Kg
Voltage100-240 VAC
PhaseSingle
Frequency50-60 Hz
Heater Controller Temperature0-250 Deg C
The Gold wire Ball-Wedge version of the automatic wire bonders in our Series 58xx featuring exchangeable bond heads.  A fully automatic mode makes it ideally suited for medium-scale production. Parts to be bonded are fed manually by the operator, but the bonds are produced completely without operator influence. Thanks to the built-in pattern recognition. Single bonds can be made within seconds, making the machine perfect for R&D, Pilot manufacturing and middle volume production.

Features:
  • A complete high productivity tabletop wire bonder at over 1 wire per second
  • Exchangeable bond heads for all wirde bond processes
  • Fully automatic wirde bonding with manual parts feeding
  • Store an unlimited number of bond programms
  • Extremely adaptable bond settings, loop shapes, force and power profiles etc.
  • Most powerfull patern recognition system on the market
  • Innovative software
  •  Gold-Ball bonding for wires from 12,5 to 50 µm using stadard capillaries 16 mm to 19 mm
  • Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces
  • Digital ultrasonic generator provides adjustable bond frequencies
  • Bumping, safety-bump, stitch-on-ball
  • Deformation Limit Control (DLC) for real-time quality checks

Wirebonders Type:
  • Ball wedge bonder
  • Thin wire wedge wedge
  • Deep access wedge wedge
  • Heavy wire wedge bonder

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Manual Wire Bonding Machine
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Manual Wire Bonding Machine

Approx. Price: Rs 35 Lakh / UnitGet Latest Price
Product Brochure
Product Details:
BrandF&S Bondtec
Wires TypeGold Wire17, 5-50 um, Aluminum Wire 17, 5-75um
Ribbons30x12, 5um, 250x25um
Ultrasonic SystemF&S Generator 67kHz
Programmable Z Asix Stroke60 mm
Programmable Y Asix Stroke20mm
Standard Working Height55mm
Manipulator in X and Y18x18mm
Dimensions63x58x40cm
Weight30 Kg
Voltage100-230 VAC
PhaseSingle
Heater Controller Temperature0-250 Deg C
Our manual/semicautomatic universal thin wire bonder 53XX BDA is the perfect choice for R&D labs, prototype building and re-pair facilities when-ever highest bond quality is required but only a limited budget is available.

It offers two bond processes in one bond-head: gold ball-bonding and deep-access wedge bonding. Switching over could not be simpler: just move the flame-off unit back, insert the wire clamp and replace the bond capillary with a wedge and you are ready to go. 

The second unique feature of the 53XX BDA is the built-in motorized Y-axis. It is fully programmable and produces an entire bond loop, complete with pro-grammable tear-off function and tail definition. Especially for miniaturized micro-wave bonds, this guarantees perfectly reproducible bonds with no operator influence.

Even for thicker wires, the cascading clamp system with one clamp above the wedge and a second clamp at the wedge foot ensures that the wire tear off is reliable and constant.


Wirebonders Type:
  • Ball wedge bonder
  • Thin wire wedge wedge bonder
  • Heavy wire Wedge Bonder
  • Heavy ribbon wedge wedge bonder


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Semi Automatic Wire Bonding Machine
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Semi Automatic Wire Bonding Machine

Approx. Price: Rs 80 Lakh / UnitGet Latest Price
Product Brochure
Product Details:
Minimum Order Quantity1 Unit
BrandF&S Bondtec
Shearheads500-50000 cN
Tweezerheads100 cN
Bondheads5610, 5630, 5632, 5650, 5650 HR
Axes Working Area100x115 mm
Step Resolution0.25 um
RepeatibilityLess than 2um
Processor1.6 GHz
RAM4 GB
Test Speed0.2-5 mm/s
Dimenstions70x65x70 cm
Weight80 Kg
Voltage100-240 VAC
PhaseSingle
Frequency50-60 Hz
Vacuum Tubing6 mm
Semi automatic wire bonder from F&S Bondtec offers below features:

>> Unbeatable flexibility

>> Changeable bondheads for all wirebond and testing process

>> Fully automatic bonding with manual part feeding

>> Store an unlimited number of bond programs

>> Extremely adaptable bond settings, loop shapes, force and power profiles etc.

>> Most powerful pattern recognition system on the market

>> Innovative and intuitiv programmable software

>> Travel distances 100 x 100 mm


Additional Information:
  • Item Code: 5610
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