Prolyx Microelectronics Private Limited
Prolyx Microelectronics Private Limited
Kumaraswamy Layout, Bengaluru, Karnataka
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Wire Bonding Machine

Offering you a complete choice of products which include automatic wire bonding machine, semi automatic wire bonding machine and manual wire bonding machine.
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Automatic Wire Bonding Machine
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Automatic Wire Bonding Machine

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Product Details:
Bonding Accuracy+/-5um
BrandBondtec
Wire TypesGold Wire, 17, 5-50um on 2" spool
BondheadBall-Wedge for gold wire, Standard capillaries 16mm length
Ultrasonic SystemF&S Generator 68 kHz
Axes Working Area200x150 mm
Programmable Step Resolution1um
Programmable Z Axis100 mm stroke
Hardware SupportDual-Core PC with Windows, Ethernet, USB 2.0/3.0,Colour Display 22"
USB DisplayUSB 2.0/3.0,Colour Display 22"
CameraGigE-CCD-Colour Camera,5 Mpixel
Control Speed1 Wire/sec
Repeatability+/-3um
Dimension92x71x65 cm
Weight80 Kg
Voltage100-240 VAC
PhaseSingle
Frequency50-60 Hz
Heater Controller Temperature0-250 Deg C
The Gold wire Ball-Wedge version of the automatic wire bonders in our Series 58xx featuring exchangeable bond heads.  A fully automatic mode makes it ideally suited for medium-scale production. Parts to be bonded are fed manually by the operator, but the bonds are produced completely without operator influence. Thanks to the built-in pattern recognition. Single bonds can be made within seconds, making the machine perfect for R&D, Pilot manufacturing and middle volume production.

Features:
  • A complete high productivity tabletop wire bonder at over 1 wire per second
  • Exchangeable bond heads for all wirde bond processes
  • Fully automatic wirde bonding with manual parts feeding
  • Store an unlimited number of bond programms
  • Extremely adaptable bond settings, loop shapes, force and power profiles etc.
  • Most powerfull patern recognition system on the market
  • Innovative software
  •  Gold-Ball bonding for wires from 12,5 to 50 µm using stadard capillaries 16 mm to 19 mm
  • Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces
  • Digital ultrasonic generator provides adjustable bond frequencies
  • Bumping, safety-bump, stitch-on-ball
  • Deformation Limit Control (DLC) for real-time quality checks

Wirebonders Type:
  • Ball wedge bonder
  • Thin wire wedge wedge
  • Deep access wedge wedge
  • Heavy wire wedge bonder


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Semi Automatic Wire Bonding Machine
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Semi Automatic Wire Bonding Machine

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Product Details:
BrandBondtec
Pullheads100-5000 cN
Shearheads500-50000 cN
Tweezerheads100 cN
Bondheads5610, 5630, 5632, 5650, 5650 HR
Axes Working Area100x115 mm
Step Resolution0.25 um
RepeatibilityLess than 2um
Processor1.6 GHz
RAM4 GB
Test Speed0.2-5 mm/s
Dimenstions70x65x70 cm
Weight80 Kg
Voltage100-240 VAC
PhaseSingle
Frequency50-60 Hz
Vacuum Tubing6 mm
The manual bond tester 5600 complements F&S Bondtec Semiconductor GmbH die- and wire- bonders. The PC controlled moving table allows any number of bonds to be tested automatically from a stored program.

Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysls as desired Powerful extended capatiilifies enable measurements such as force/tme curves to be made and deliver more data about the quality of the bond tested.

Exchangeable measurement cartridges ensure rapid conversion to different force range. The calibration curves of all measurement cartridges are stored internally; additional heads for shear, peel and tweezer testing with customer-specific tools and jaws are available.

Wirebonders Type:
  • Universal Wire Bonder and Tester
  • Standalone Bond tester
  • Ball wedge bonder
  • Thin wire wedge wedge
  • Deep access wedge wedge
  • Heavy wire wedge wedge



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Manual Wire Bonding Machine
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Manual Wire Bonding Machine

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Product Details:
BrandBondtec
Wires TypeGold Wire17, 5-50 um, Aluminum Wire 17, 5-75um
Ribbons30x12, 5um, 250x25um
Ultrasonic SystemF&S Generator 67kHz
Programmable Z Asix Stroke60 mm
Programmable Y Asix Stroke20mm
Standard Working Height55mm
Manipulator in X and Y18x18mm
Dimensions63x58x40cm
Weight30 Kg
Voltage100-230 VAC
PhaseSingle
Heater Controller Temperature0-250 Deg C
Our manual/semicautomatic universal thin wire bonder 53XX BDA is the perfect choice for R&D labs, prototype building and re-pair facilities when-ever highest bond quality is required but only a limited budget is available.

It offers two bond processes in one bond-head: gold ball-bonding and deep-access wedge bonding. Switching over could not be simpler: just move the flame-off unit back, insert the wire clamp and replace the bond capillary with a wedge and you are ready to go. 

The second unique feature of the 53XX BDA is the built-in motorized Y-axis. It is fully programmable and produces an entire bond loop, complete with pro-grammable tear-off function and tail definition. Especially for miniaturized micro-wave bonds, this guarantees perfectly reproducible bonds with no operator influence.

Even for thicker wires, the cascading clamp system with one clamp above the wedge and a second clamp at the wedge foot ensures that the wire tear off is reliable and constant.


Wirebonders Type:
  • Ball wedge bonder
  • Thin wire wedge wedge bonder
  • Heavy wire Wedge Bonder
  • Heavy ribbon wedge wedge bonder


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