Prolyx Micro Electronics Private Limited

Our manual/semicautomatic universal thin wire bonder 53XX BDA is the perfect choice for R&D labs, prototype building and re-pair facilities when-ever highest bond quality is required but only a limited budget is available.

It offers two bond processes in one bond-head: gold ball-bonding and deep-access wedge bonding. Switching over could not be simpler: just move the flame-off unit back, insert the wire clamp and replace the bond capillary with a wedge and you are ready to go. 

The second unique feature of the 53XX BDA is the built-in motorized Y-axis. It is fully programmable and produces an entire bond loop, complete with pro-grammable tear-off function and tail definition. Especially for miniaturized micro-wave bonds, this guarantees perfectly reproducible bonds with no operator influence.

Even for thicker wires, the cascading clamp system with one clamp above the wedge and a second clamp at the wedge foot ensures that the wire tear off is reliable and constant.


Wirebonders Type:

• Ball wedge bonder
• Thin wire wedge wedge bonder
• Heavy wire Wedge Bonder
• Heavy ribbon wedge wedge bonder

Semi automatic wire bonder from F&S Bondtec offers below features:

• Unbeatable flexibility
• Changeable bondheads for all wirebond and testing process
• Fully automatic bonding with manual part feeding
• Store an unlimited number of bond programs
• Extremely adaptable bond settings, loop shapes, force and power profiles etc.
• Most powerful pattern recognition system on the market
• Innovative and intuitiv programmable software
• Travel distances 100 x 100 mm

 

The Gold wire Ball-Wedge version of the automatic wire bonders in our Series 58xx featuring exchangeable bond heads.  A fully automatic mode makes it ideally suited for medium-scale production. Parts to be bonded are fed manually by the operator, but the bonds are produced completely without operator influence. Thanks to the built-in pattern recognition. Single bonds can be made within seconds, making the machine perfect for R&D, Pilot manufacturing and middle volume production.

Features:

• A complete high productivity tabletop wire bonder at over 1 wire per second
• Exchangeable bond heads for all wirde bond processes
• Fully automatic wirde bonding with manual parts feeding
• Store an unlimited number of bond programms
• Extremely adaptable bond settings, loop shapes, force and power profiles etc.
• Most powerfull patern recognition system on the market
• Innovative software
•  Gold-Ball bonding for wires from 12,5 to 50 µm using stadard capillaries 16 mm to 19 mm
• Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces
• Digital ultrasonic generator provides adjustable bond frequencies
• Bumping, safety-bump, stitch-on-ball
• Deformation Limit Control (DLC) for real-time quality checks

Wirebonders Type:

• Ball wedge bonder
• Thin wire wedge wedge
• Deep access wedge wedge
• Heavy wire wedge bonder