Wire Bonding Machine

Offering you a complete choice of products which include cob(chip on board) wire bonding services, automatic wire bonding machine, semi automatic wire bonding machine, manual wire bonding machine and wire bonding machine.

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COB(Chip On Board) Wire Bonding Services

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Product Details:

Copper Thickness	customized
Usage/Application	Microelectronics
Mounted Product	yes
Size	Max. 200mm*300mm
Color	green
Design	Customised
Country of Origin	Made in India

Semiconductor Chips are bonded on the package, Chips and internal leads of package are connected by bonding, using fine metal wires of aluminium and Gold for commercial/IOT/RF/Medical/Optoelectronic devices.

We offer High accuracy, high speed and automation to achieve reliable wire bonding services by

Gold-wire thermocompression ball-bonding method
Aluminium-wire ultrasonic wedge bonding
Reliability measurements using Pull tester ( pull test gauge)

Additional Information:

Production Capacity: Depends on PCB design
Delivery Time: As per Schedule
Packaging Details: As per Semiconductor packaging standards

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Automatic Wire Bonding Machine

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Product Details:

Bonding Accuracy	+/-5um
Brand	Bondtec
Wire Types	Gold Wire, 17, 5-50um on 2" spool
Bondhead	Ball-Wedge for gold wire, Standard capillaries 16mm length
Ultrasonic System	F&S Generator 68 kHz
Axes Working Area	200x150 mm
Programmable Step Resolution	1um
Programmable Z Axis	100 mm stroke
Hardware Support	Dual-Core PC with Windows, Ethernet, USB 2.0/3.0,Colour Display 22"
USB Display	USB 2.0/3.0,Colour Display 22"
Camera	GigE-CCD-Colour Camera,5 Mpixel
Control Speed	1 Wire/sec
Repeatability	+/-3um
Dimension	92x71x65 cm
Weight	80 Kg
Voltage	100-240 VAC
Phase	Single
Frequency	50-60 Hz
Heater Controller Temperature	0-250 Deg C

The Gold wire Ball-Wedge version of the automatic wire bonders in our Series 58xx featuring exchangeable bond heads. A fully automatic mode makes it ideally suited for medium-scale production. Parts to be bonded are fed manually by the operator, but the bonds are produced completely without operator influence. Thanks to the built-in pattern recognition. Single bonds can be made within seconds, making the machine perfect for R&D, Pilot manufacturing and middle volume production.

Features:

A complete high productivity tabletop wire bonder at over 1 wire per second
Exchangeable bond heads for all wirde bond processes
Fully automatic wirde bonding with manual parts feeding
Store an unlimited number of bond programms
Extremely adaptable bond settings, loop shapes, force and power profiles etc.
Most powerfull patern recognition system on the market
Innovative software
Gold-Ball bonding for wires from 12,5 to 50 µm using stadard capillaries 16 mm to 19 mm
Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces
Digital ultrasonic generator provides adjustable bond frequencies
Bumping, safety-bump, stitch-on-ball
Deformation Limit Control (DLC) for real-time quality checks

Wirebonders Type:

Ball wedge bonder
Thin wire wedge wedge
Deep access wedge wedge
Heavy wire wedge bonder

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Semi Automatic Wire Bonding Machine

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Product Details:

Brand	Bondtec
Pullheads	100-5000 cN
Shearheads	500-50000 cN
Tweezerheads	100 cN
Bondheads	5610, 5630, 5632, 5650, 5650 HR
Axes Working Area	100x115 mm
Step Resolution	0.25 um
Repeatibility	Less than 2um
Processor	1.6 GHz
RAM	4 GB
Test Speed	0.2-5 mm/s
Dimenstions	70x65x70 cm
Weight	80 Kg
Voltage	100-240 VAC
Phase	Single
Frequency	50-60 Hz
Vacuum Tubing	6 mm

The manual bond tester 5600 complements F&S Bondtec Semiconductor GmbH die- and wire- bonders. The PC controlled moving table allows any number of bonds to be tested automatically from a stored program.

Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysls as desired Powerful extended capatiilifies enable measurements such as force/tme curves to be made and deliver more data about the quality of the bond tested.

Exchangeable measurement cartridges ensure rapid conversion to different force range. The calibration curves of all measurement cartridges are stored internally; additional heads for shear, peel and tweezer testing with customer-specific tools and jaws are available.

Wirebonders Type:

Universal Wire Bonder and Tester
Standalone Bond tester
Ball wedge bonder
Thin wire wedge wedge
Deep access wedge wedge
Heavy wire wedge wedge

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Manual Wire Bonding Machine

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Product Details:

Brand	Bondtec
Wires Type	Gold Wire17, 5-50 um, Aluminum Wire 17, 5-75um
Ribbons	30x12, 5um, 250x25um
Ultrasonic System	F&S Generator 67kHz
Programmable Z Asix Stroke	60 mm
Programmable Y Asix Stroke	20mm
Standard Working Height	55mm
Manipulator in X and Y	18x18mm
Dimensions	63x58x40cm
Weight	30 Kg
Voltage	100-230 VAC
Phase	Single
Heater Controller Temperature	0-250 Deg C

Our manual/semicautomatic universal thin wire bonder 53XX BDA is the perfect choice for R&D labs, prototype building and re-pair facilities when-ever highest bond quality is required but only a limited budget is available.

It offers two bond processes in one bond-head: gold ball-bonding and deep-access wedge bonding. Switching over could not be simpler: just move the flame-off unit back, insert the wire clamp and replace the bond capillary with a wedge and you are ready to go.

The second unique feature of the 53XX BDA is the built-in motorized Y-axis. It is fully programmable and produces an entire bond loop, complete with pro-grammable tear-off function and tail definition. Especially for miniaturized micro-wave bonds, this guarantees perfectly reproducible bonds with no operator influence.

Even for thicker wires, the cascading clamp system with one clamp above the wedge and a second clamp at the wedge foot ensures that the wire tear off is reliable and constant.

Wirebonders Type:

Ball wedge bonder
Thin wire wedge wedge bonder
Heavy wire Wedge Bonder
Heavy ribbon wedge wedge bonder

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