Our manual/semicautomatic universal thin wire bonder 53XX BDA is the perfect choice for R&D labs, prototype building and re-pair facilities when-ever highest bond quality is required but only a limited budget is available.
It offers two bond processes in one bond-head: gold ball-bonding and deep-access wedge bonding. Switching over could not be simpler: just move the flame-off unit back, insert the wire clamp and replace the bond capillary with a wedge and you are ready to go.
The second unique feature of the 53XX BDA is the built-in motorized Y-axis. It is fully programmable and produces an entire bond loop, complete with pro-grammable tear-off function and tail definition. Especially for miniaturized micro-wave bonds, this guarantees perfectly reproducible bonds with no operator influence.
Even for thicker wires, the cascading clamp system with one clamp above the wedge and a second clamp at the wedge foot ensures that the wire tear off is reliable and constant.
- Ball wedge bonder
- Thin wire wedge wedge bonder
- Heavy wire Wedge Bonder
- Heavy ribbon wedge wedge bonder