Prolyx Micro Electronics Private Limited

Bengaluru, Karnataka

GST No. 29AABCP9422H1Z8

Call 0804860918693% Response Rate

Send Enquiry

Wafer Dicing Service

Leading Service Provider of wafer dicing service from Bengaluru.

Wafer Dicing Service

  • Product Image
  • Video Image
  • Product Image
  • Product Image
Product Image
Get Best Quote
Rs 4500 / PiecePrice on Request
Wafer DiameterUpto 6 inch
Machine TypeSemi-Automatic
Crystal OrientationAny orientation
Usage/ApplicationIndustrial
Country of OriginMade in India
Service ModeOffline
Service Duration2-3 Days
Service LocationBengaluru
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting.

View Complete details

Yes! I am InterestedRequest a call back