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Prolyx Microelectronics Private Limited
Prolyx Microelectronics Private Limited
Vasanthapura, Bengaluru, Karnataka
GST No. 29AABCP9422H1Z8
08048609186 90% Response Rate
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Wafer Dicing Service

Leading Manufacturer of wafer dicing service from Bengaluru.
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Wafer Dicing Service
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Wafer Dicing Service

Approx. Price: Rs 6,000 / UnitGet Latest Price
Product Details:
Minimum Order Quantity1 Unit
MaterialAny
Usage/ApplicationPrototyping
Machine TypeSemi-Automatic
BladeDiamond
Size/DimensionAny
Country of OriginMade in India
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting.

Additional Information:
  • Delivery Time: 1 week
  • Packaging Details: Wafer carrier
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