|Minimum Order Quantity||1 Unit|
|Country of Origin||Made in India|
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting.
- Delivery Time: 1 week
- Packaging Details: Wafer carrier