Product Details:
Minimum Order Quantity | 1 Unit |
Material | Any |
Usage/Application | Prototyping |
Machine Type | Semi-Automatic |
Blade | Diamond |
Size/Dimension | Any |
Country of Origin | Made in India |
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting.
Additional Information:
- Delivery Time: 1 week
- Packaging Details: Wafer carrier