Service Details:
Usage/Application | Prototyping |
Material | Steel |
Machine Type | Semi-Automatic |
Country of Origin | Made in India |
Service Mode | Offline |
Service Duration | 2-3 Days |
Service Location | Bengaluru |
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting.