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Prolyx Microelectronics Private Limited
Prolyx Microelectronics Private Limited
Vasanthapura, Bengaluru, Karnataka
GST No. 29AABCP9422H1Z8
08048609186 91% Response Rate
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Wafer Dicing Service

Leading Service Provider of wafer dicing service from Bengaluru.
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  • Wafer Dicing Service
  • Wafer Dicing Service
  • Wafer Dicing Service
Wafer Dicing Service
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Wafer Dicing Service

Service Details:
Usage/ApplicationPrototyping
MaterialSteel
Machine TypeSemi-Automatic
Country of OriginMade in India
Service ModeOffline
Service Duration2-3 Days
Service LocationBengaluru
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting.

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4.2/5

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Reviewed by 15 Users

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  • User Satisfaction
  • Response100%
  • Quality     100%
  • Delivery   100%

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