Prolyx Micro Electronics Private Limited
Bengaluru, Karnataka
GST No. 29AABCP9422H1Z8
Call 08048609186 92% Response Rate
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Automatic Sawing Machine
We are a leading Service Provider of fully automatic dicing saw from Bengaluru, India.
Fully Automatic Dicing Saw
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Price on Request
Product Brochure
| Minimum Order Quantity | 1 Piece |
| Size | 12 inch |
| Usage/Application | Industrial |
| Power Consumption (Watt) | 200-240 VAC, 50/60 Hz, single phase |
| Spindle Speed | Two facing 1.8 kW or 2.2 kW, max. 60,000 rpm |
| Workpiece Size | 8", 12" or 12" x 12" square |
| Blade Size | 2" - 3" |
| Dimensions | (W x D x H) mm: 1145 x 1687 x 1830 ; Weight: 1,500kg |
A high-Precision Dicing solution developed by Advanced Dicing Technologies (ADT), the 8030 Dicing Saw is designed for the singulating Wafers, substrate and packages devices with exceptional accuracy. It supports both single and dual spindle configuration and is capable of handling wafers up to 8 inches (200mm). with advanced alignment systems, high-Speed spindles (up to 60000rpm) and supports for hub/hubles blades, the 8030 is optimized for high throughput and minimal kerf loss.
II. Applications of the Product
Used for precision cutting in;
• Silicon, GaAs, Sic, and glass wafers
• MEMS and photonics devices
• Packaged ICs (BGA, QFN, etc.)
• Optoelectronics components and sensors
Additional Information:
- Item Code: 8030
- Production Capacity: 1
- Delivery Time: 10-14 weeks
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