Prolyx Micro Electronics Private Limited

Bengaluru, Karnataka

GST No. 29AABCP9422H1Z8

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Automatic Sawing Machine

We are a leading Service Provider of fully automatic dicing saw from Bengaluru, India.

Fully Automatic Dicing Saw

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Product Brochure

Minimum Order Quantity1 Piece
Size12 inch
Usage/ApplicationIndustrial
Power Consumption (Watt)200-240 VAC, 50/60 Hz, single phase
Spindle SpeedTwo facing 1.8 kW or 2.2 kW, max. 60,000 rpm
Workpiece Size8", 12" or 12" x 12" square
Blade Size2" - 3"
Dimensions(W x D x H) mm: 1145 x 1687 x 1830 ; Weight: 1,500kg
I. Overview of the Product
A high-Precision Dicing solution developed by Advanced Dicing Technologies (ADT), the 8030 Dicing Saw is designed for the singulating Wafers, substrate and packages devices with exceptional accuracy. It supports both single and dual spindle configuration and is capable of handling wafers up to 8 inches (200mm). with advanced alignment systems, high-Speed spindles (up to 60000rpm) and supports for hub/hubles blades, the 8030 is optimized for high throughput and minimal kerf loss.

II. Applications of the Product
Used for precision cutting in;
• Silicon, GaAs, Sic, and glass wafers
• MEMS and photonics devices
• Packaged ICs (BGA, QFN, etc.)
• Optoelectronics components and sensors

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